Thisbookfirstlyintroducesthepertinentfundamentaltheory，importantmaterialandfabricationprocessofmicroＧelectromechanicalsystems．Basedonthesetheories，thedesignruleandimportantengineeringexamplesaredescribedindetail．Then，manyengineeringapplicationsforMEMSincludingtheaccelerationmeasurement，theangularspeedmeasurementandthepressuremeasurementareintroduced．Finally，finiteelementmethodisintroducedinordertoprovethecorrectnessofthedesign．Thisengineeringapplicationofsimulationincludesthestaticandmodalanalysisofthebeam，capacitanceanalysis，thermalＧstructureanalysisofthedeviceandfatigueanalysisetc．Itcanbeselectedasthereferencetothepostgraduates，undergraduatesandpertinentengineeringstaffwhoseresearch directionsareinstrumentationscienceandtechnology，controlscienceandengineering，mechanicalengineeringetc．

Chapter1　Introduction ………………………………………………………………………… 1
1．1　ConceptofMEMS ……………………………………………………………………… 1
1．2　DevelopmentofMEMS ………………………………………………………………… 4
1．3　MEMSCAD …………………………………………………………………………… 9
Chapter2　BasictheoryofMEMS …………………………………………………………… 12
2．1　TheoryofelectrostaticMEMScombactuators …………………………………… 12
2．1．1　Introduction ……………………………………………………………………… 12
2．1．2　Operatingprinciples …………………………………………………………… 13
2．1．3　Platecapacitortheoryinidealcondition ……………………………………… 14
2．1．4　ThemodifiedmodelofMEMSplatecapaciator ……………………………… 17
2．1．5　Calculationofelectrostaticcombdrivingforceinidealsituation …………… 24
2．1．6　Weakcapacitancedetectionmethodofelectrostaticcombdrive …………… 26
2．2　RelevanttheoreticalcalculationsfortheMEMScantileverbeam ………………… 34
2．2．1　Introduction ……………………………………………………………………… 34
2．2．2　Theoreticalcalculationmethodforcantileverbeam ………………………… 35
2．2．3　RelevanttheoreticalcalculationofaxialtensileandcompressiveonsingleGend
clampedbeams ………………………………………………………………… 36
2．2．4　RelatedtheoreticalcalculationsofdoubleGendclampedbeamsaxialtension
andcompression ………………………………………………………………… 40
2．3　MembranetheoryofMEMS ………………………………………………………… 47
2．3．1　Theoryofclampedaroundcirculardiaphragm ………………………………… 48
2．3．2　Theoryofclampedaroundrectangularflatdiaphragm ……………………… 49
References …………………………………………………………………………………… 52
Chapter3　MEMSmaterials …………………………………………………………………… 53
3．1　Monocrystallinesilicon ……………………………………………………………… 53
3．1．1　Introduction ……………………………………………………………………… 53
3．1．2　Crystalorientationofmonocrystallinesilicon ………………………………… 55
3．2　Polycrystallinesilicon ………………………………………………………………… 64
3．3　Silica …………………………………………………………………………………… 66
3．4　Piezoelectricmaterials ………………………………………………………………… 67
3．4．1　Piezoelectriceffectandinversepiezoelectriceffectofmaterials …………… 67
3．4．2　Quartzcrystal …………………………………………………………………… 68
3．4．3　Piezoelectricceramics …………………………………………………………… 73
3．5　OtherMEMSmaterials ……………………………………………………………… 75
3．6　Summary ……………………………………………………………………………… 76
Chapter4　MEMStechnology ………………………………………………………………… 77
4．1　MEMSlithographyprocess ………………………………………………………… 78
4．2　KeytechnologyofMEMSlithographyprocess …………………………………… 80
4．2．1　Wafercleaning …………………………………………………………………… 80
4．2．2　Siliconoxidation ………………………………………………………………… 80
4．2．3　Spincoatingprocess …………………………………………………………… 87
4．2．4　Prebaking ………………………………………………………………………… 90
4．2．5　Exposure ………………………………………………………………………… 92
4．2．6　Development ……………………………………………………………………… 94
4．2．7　Hardening ………………………………………………………………………… 96
4．2．8　FabricationoftheSiO2 window ………………………………………………… 97
4．3　SubsequentprocessofMEMS ……………………………………………………… 98
4．3．1　Bulksilicontechnology ………………………………………………………… 98
4．3．2　Surfacesiliconprocess ………………………………………………………… 103
4．3．3　LIGAtechnology ……………………………………………………………… 104
4．3．4　Sputteringtechnology ………………………………………………………… 105
4．3．5　LiftGoffprocess ………………………………………………………………… 107
4．4　Filmpreparationtechnology………………………………………………………… 107
4．5　Bondingprocess ……………………………………………………………………… 108
4．5．1　Anodicbondingprocess………………………………………………………… 109
4．5．2　SiliconGsilicondirectbonding ………………………………………………… 110
4．5．3　Metaleutecticbonding ………………………………………………………… 113
4．5．4　Coldpressureweldingbonding ……………………………………………… 114
4．6　Engineeringexamplesofcombinationformultipleprocessestofabricatethe
MEMSdevice ………………………………………………………………………… 115
4．6．1　Introduction …………………………………………………………………… 115
4．6．2　EngineeringexampleoffabricationprocessforresonantMEMSgyroscope
…………………………………………………………………………………… 115
4．6．3　EngineeringexampleofelectromagneticmicroGmotorproductionprocess
…………………………………………………………………………………… 118
4．7　Summary ……………………………………………………………………………… 124
References…………………………………………………………………………………… 125
Chapter5　Frictionwearandtearundermicroscale ……………………………………… 126
5．1　OffGchiptestingmethodformicrofriction ………………………………………… 127
5．1．1　MicroGtribologytestwiththepinGonGdiscmeasuringmethod ……………… 127
5．1．2　MicroGtribologytestwithAFM ……………………………………………… 128
5．1．3　MicroGtribologytestwithspecialmeasuringdevice ………………………… 130
5．2　OnGchiptestingmethodformicrofriction ………………………………………… 132
5．2．1　OnGchiptestingmethodactuatedbyelectrostaticforce …………………… 132
5．2．2　OnGchipmicroGfrictiontestingmethodusingthemechanismcharactersof
thebimorphmaterial…………………………………………………………… 139
5．3　ExampleofthedesignforanonGchipmicroGfrictionstructure ………………… 141
5．3．1　Structureandworkingprinciple ……………………………………………… 141
5．3．2　Calculationofpertinenttheory ……………………………………………… 142
5．3．3　Technologicalanalysisofstructuraldesign ………………………………… 148
5．3．4　Testingresultsanddataanalysis……………………………………………… 152
5．3．5　ResearchandtestofwearproblemofMEMSdevices ……………………… 161
5．4　Summary ……………………………………………………………………………… 165
References…………………………………………………………………………………… 165
Chapter6　MEMStestingtechnologyandengineeringapplication ………………………… 169
6．1　Accelerationmeasurementandcorrespondingsensors …………………………… 169
6．1．1　Workingprincipleoftheaccelerationsensorandtheclassification ……… 170
6．1．2　Capacitivesiliconmicromechanicalaccelerometer …………………………… 172
6．1．3　Piezoresistivesiliconmicromechanicalaccelerometer ……………………… 173
6．1．4　Piezoelectricmicromechanicalaccelerometer ………………………………… 174
6．1．5　ResonantsiliconMEMSaccelerometer ……………………………………… 175
6．2　Angularspeedmeasurementandcorrespondingsensors ………………………… 177
6．2．1　Workingprinciple ……………………………………………………………… 177
6．2．2　DevelopmentofMEMSgyroscope …………………………………………… 178
6．2．3　Classificationofmicromechanicalgyroscope ………………………………… 188
6．3　Pressuremeasurementandcorrespondingsensors ……………………………… 190
6．3．1　Workingpincinple ……………………………………………………………… 190
6．3．2　Resonantsiliconmicromechanicalpressuresensoranditsdevelopment … 193
6．4　MeasurementofmicroGtorque ……………………………………………………… 198
6．4．1　Introduction …………………………………………………………………… 198
6．4．2　Workingprincipleofnoncontactmethod …………………………………… 199
6．4．3　Theoreticalcalculation ………………………………………………………… 200
6．4．4　Correspondingequipmenttorealizethenoncontactmethod ……………… 205
6．4．5　Experimentresultanddiscussion …………………………………………… 209
6．5　Microscopicmorphologytestingmethod ………………………………………… 211
6．6　Summary ……………………………………………………………………………… 212
References…………………………………………………………………………………… 212
Chapter7　Applicationexamplesofthefiniteelementmethodinthedesignof
MEMSdevices …………………………………………………………………… 218
7．1　Importantconceptsofthesoftware………………………………………………… 218
7．2　IntroductionoftheAnsyssoftwareinterface……………………………………… 220
7．3　ThecoordinatesysteminAnsys …………………………………………………… 221
7．4　Engineeringexamples ……………………………………………………………… 226
7．4．1　StaticanalysisofsingleGclampedbeam ……………………………………… 226
7．4．2　ModalanalysisofdoubleGclampedbeam ……………………………………… 245
7．4．3　CapacitanceanalysisofMEMSelectrostaticcombfingersdrive …………… 257
7．4．4　Fatiguestrengthcalculationexample ………………………………………… 264
7．5　Summary ……………………………………………………………………………… 272